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PCB Technology

Glossary and Abbreviations - PCB Glossary

Click on an alphabet below to directly jump to the chosen alphabet section...

ABCDEFGHIJKLMNOPQRSTUVWXYZ

Alphabet I

  • ImagingThe process of transferring electronic data to the photo-plotter, which in turn uses light to transfer a negative image circuitry pattern onto the panel or film.
  • Immersion PlatingThe chemical deposition of a thin metallic coating over certain basis metals that is achieved by a partial displacement of the basis metal.
  • ImpedanceThe resistance to the flow of current, represented by an electrical network of combined resistance, capacitance and inductance reaction, in a conductor as seen by an AC source of varying time voltage. The unit of measure is ohms.
  • InclusionsForeign particles, metallic or nonmetallic, that may be entrapped in an insulating material, conductive layer, plating, base material, or solder connection.
  • In-Circuit TestElectrical test of individual component or part of the circuit in a PCB assembly instead of testing the whole circuit.
  • InkjettingThe dispersal of well-defined ink "dots" onto a PCB. Inkjet equipment uses heat to liquefy a solid ink pellet and change the ink into a liquid, which is then dropped via a nozzle onto the printed surface, where it quickly dries.
  • Insulation ResistanceThe electrical resistance of an insulating material that is determined under specific conditions between any pair of contacts, conductors, or grounding devices in various combinations.
  • Inspection GuidelinesAll boards meet IPC Class 2 Guidelines.
  • Internal LayerA conductive pattern which is contained entirely within a multilayer printed board
  • Internal Power and Ground LayersThese are usually solid copper plains of a multi-layer board that carry power or are ground. Please generate these layers as negatives. Make any clearances on these layers .035” over the drill / tool size. This will prevent shorting from occurring with layer shifting on inner layers.
  • Interconnect Stress TestThe IST system is designed to quantify the ability of the total interconnect to withstand the thermal and mechanical strains, from the as manufactured state, until the product reaches the point of interconnect failure.
  • Interstitial Via HoleAn embedded through-hole with connection of two or more conductor layers in a multilayer PCB.
  • Immersion coatingElectroless coating of copper in traditional pcb manufacture to achieve the basis of through hole plating, and/or the electroless deposition of tin, silver, or nickel and gold to pads and holes to offer a solderable finish to the circuitry. Tracks might also be coated in this way for particular reasons.
  • IPC–(The Institute for Interconnecting and Packaging Electronic Circuits)The final American authority on how to design and manufacture printed Circuit Board.

PCB Design Tips

When designing a PCB, try to limit the amount of draws you use. Draws use a lot of memory and slow the programming time. Use a flash for pads instead.

More tips...
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For printed circuit boards (PCBs) or PCB assembly you can count on. Talk to the friendly and experienced team at QualiEco Circuits, New Zealand.