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Home Knowledge Centre Glossary and Abbreviations - Abbreviations for Printed Circuit Boards

Knowledge Centre

Glossary and Abbreviations - Abbreviations for Printed Circuit Boards
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Click on an alphabet below to directly jump to the chosen alphabet section...

ABCDEFGHIJKLMNOPQRSTUVWXYZ

[ Go to TOP ]Alphabet A

  • ACalternate current
  • ACIautomatic component inser tion
  • ADJadjust
  • ALaluminum = Aluminium
  • AMPamperage / Ampere
  • AMTamount
  • ANALanalysis / analyze
  • ANGangle
  • ANSIAmerican National Standards Institute
  • AOIautomatic optical inspection
  • APLapplicable
  • APRautomatic photo tool registration
  • AQLacceptance quality level
  • ARannular ring
  • ASAPas soon as possible
  • ASSYassembly
  • ASTMAmerican Society for Testing & Materials
  • AUgold
  • AUTHauthorize / authorization
  • AUXauxiliary
  • AVGaverage
  • AWartwork

[ Go to TOP ]Alphabet B

  • B&Tbow and twist

  • BBTbare board test

  • BDboard

  • BGAball grid array

  • BKback

  • BKPLNbackplane

  • BKPNLback panel

  • BKTbracket

  • BLKblack / block

  • BLNKblank

  • BLUblue

  • BObreak out

  • BOMbill of material

  • BPbackplane / back panel

  • BRDboard

  • BSbackside

  • BTMbottom

  • BUMbuilt up method

  • BUTbuilt up technology

  • BVHburied via hole

  • BVLbevel

[ Go to TOP ]Alphabet C

  • Ccircuitry

  • CADcomputer-aided design

  • CAEcomputer-aided engineering

  • CAIcomputer-aided instruction

  • CALCcalculate

  • CAMcomputer-aided manufacturing

  • CAPcapacitor / capacity

  • CBOREcounter bore

  • CCconformal coating

  • CCCcurrent carrying capacity

  • CEM-1Composite epoxy material. Laminate manufactured with a paper core, outer layers of fibre-glass and epoxy as binding agent. Normally non-inflammable = Composite Epoxy Material.

  • CFcopper foil

  • CHARcharacter / characteristic

  • CHGchange

  • CHKcheck

  • CIcontrolled impedance

  • CIRCcircuit

  • CLclass

  • CLNclean

  • CLRclear / clearance

  • CMPcomponent

  • CNCcomputer numerically controlled

  • CNTcount

  • CNTRcenter

  • CNTRLcontrol

  • COBchip on board

  • CofCcertificate of conformance

  • COMPcomponent

  • CONDconductor / condition

  • CONFconformance / conference

  • CONNconnector

  • CEM-3Composite epoxy material. Laminate manufactured with non-woven glass matting as core, outer layers of gass weave and epoxy as binding agent. Normally noninflammable = Composite Epoxy Material.

  • CONTcontinue / continuity

  • Cpkprocess capability index (range within specification)

  • CPNcoupon = Coupon

  • CScomponent side

  • CSKcountersink

  • CSPchip size package

  • CTEcoefficient of thermal expansion

  • CUcopper

  • CVRcover

[ Go to TOP ]Alphabet D

  • DCdirect current / date code / document control

  • DECdecimal

  • DECdocument

  • DEGdegree

  • DEPdeposit / deposition

  • DESdevelop-etch-strip / design

  • DESCDefense Electronic Supply Center = Defense Electronic Supply Center (USA)

  • DFdry film / difunctional

  • DFMdesign for manufacturability

  • DFTdouble-treat foil / design for test

  • DIAdiameter

  • DIELdielectric

  • DIMdimension = Dimension

  • DISTdistribute / distribution

  • Dkdielectric constant

  • DLADefense Logistics Agency = Defense Logistics Agency (USA)

  • DODDepar tment of Defense / Date of Delivery

  • DPdrill program

  • DRCdesign rule check

  • DRLdrill

  • DSdimensional stability / double-sided

  • DTFdouble-treat foil

  • DTLdetail = Detail

  • DTPdiameter

  • DWGdrawing

  • DWVdielectric with standing voltage

[ Go to TOP ]Alphabet E

  • E-AUelectroless gold

  • ECeach

  • EEelectrical engineer

  • EMSelectronics manufacturing services

  • EMULemulsion = Emulsion

  • ENGengineer / engage

  • ENGRengineer

  • E-NIelectroless nickel

  • ENIGelectroless nickel immersion gold

  • ERrelative dielectric constant

  • ESDelectro-static discharge / electro-static device

  • ETelectrical test

  • EVALevaluation / evaluate

  • EXexample

  • EXPexpose / exposure / expire

  • EXTexternal / extension

[ Go to TOP ]Alphabet F

  • FR2Flame Retardant. Laminate manufactured from paper with phenolic binding agent. Flame retardant material has been added

  • FR3Flame Retardant. Laminate manufactured from paper with epoxy binding agent. Flame retardant material has been added.

  • FAfirst article

  • FABfabrication / fabricate

  • FAEfirst article report

  • FAIfirst article inspection

  • FGIfinished goods inventory

  • FHSfinished hole size

  • FR4Flame Retardant. Laminate manufactured from fibre-glass weave with epoxy binding agent. Flame retardant material has been added.

  • FLTflat

  • FMfrom

  • FNLfinal

  • FPWflex printed wiring

  • FREQfrequency

  • FSfar side

  • FUNCfunction / functional

[ Go to TOP ]Alphabet G

  • GLSglass

  • GNDground

  • GRNgreen

[ Go to TOP ]Alphabet H

  • HALhot air leveling

  • HARBheight aspect ratio boards

  • HASLhot air solder levelling

  • HDIShigh density interconnection system

  • HLhole

  • HLSholes

  • HMTHole mounting technology. Leaded components are mounted by inser ting (and soldering) their leads through holes in the PCB

  • HRChigh resin content

  • HTEhigh tensile elongation

[ Go to TOP ]Alphabet I

  • IECInternational Electro-technical Commission

  • IJInkjet

  • IJPInkjet Printing

  • ILinner layer

  • ILinsulation resistance / infrared

  • IMGimage

  • IMMimmersion

  • IMMAUimmersion gold

  • INSPinspect / inspection

  • INTinternal

  • INVinventory

  • IPCInstitute for Interconnecting and Packaging Electronic Circuits

  • ISinside / information system

  • ISSissue

  • ITRIInterconnection Technology Research Institute

  • IVHInterstitial Via Hole (Board)

[ Go to TOP ]Alphabet J

  • JITJust in time

  • JSJump Scoring

[ Go to TOP ]Alphabet K

  • KFkapton film

[ Go to TOP ]Alphabet L

  • LAMlaminate / lamination

  • LCCleadless chip carrier

  • LCCCleadless ceramic chip carrier

  • LDILaser Direct Imaging

  • LDPLaser Direct Patterning

  • LDSLaser Direct Structuring

  • LEGlegend

  • LIGALithography and Galvanoforming (technique)

  • LOClocate / location

  • LPIliquid photoimageable

  • LPISRliquid photoimageable solder resist

  • LRClow resin content

  • LSRlaser

  • LWline width

  • LYRlayer

[ Go to TOP ]Alphabet M

  • MATLmaterial = Material

  • MBVmicro blind via

  • MEmechanical engineer

  • MFmultifunctional

  • MFGmanufacturing

  • MFRmanufacturer

  • MGRmanager = Manager

  • MINminimum = Minimum

  • MIPmanufacturing instruction procedure / multiple inline package

  • MIRmoisture & insulation resistance

  • MLmultilayer

  • MLBmultilayer board

  • MMCmaximum material condition

  • MRBmaterial review board

  • MRPmanufacturing resource planning

  • MSGmessage

  • MSTRmaster

  • MTLmetal

  • MVmicro via

  • MVHmicro via hole

[ Go to TOP ]Alphabet N

  • NAnot applicable

  • NCnumerically controlled

  • NCMnon-conforming

  • NEGnegative

  • NEMANational Electrical Manufacturer's Association

  • NFnon-functional

  • NHSnominal hole size

  • NInickel = Nickel

  • Ni/Pnickel / phosphor

  • NOMnominal

  • NPnon-plated

  • NPTnon-plated thru

  • NPTHnon-plated-thru hole

  • NSTDnon-standard

  • NTSnot-to-scale

[ Go to TOP ]Alphabet O

  • OAoverall

  • OAIo.k. as is

  • ODouter diameter

  • OEMoriginal equipment manufacturer

  • OLouter layer

  • ORGorganize / organization

  • ORIGoriginal

  • OSoptical sight / Fiducial marks

  • OSIon-screen inspection

  • OSPorganic solderability preservative (anti-oxidant coating)

  • OZounce

[ Go to TOP ]Alphabet p

  • PACpad array carrier

  • Pblead

  • PbSnlead-tin

  • PCprinted circuit / production control

  • PCBprinted circuit board

  • PCTpressure cooker testing

  • PEproduct engineer / process engineer

  • PEBpost exposure bake

  • PEPpost-etch punch

  • PFIpolymer film interconnect

  • PIDphotoimageable dielectric

  • PIHpin in hole

  • PLparts list

  • PLCplace

  • PLCSplaces

  • PLNplane / plan

  • PLNGplanning

  • PLNRplanner

  • PLTplate

  • PLTDplated

  • PMpreventive maintenance

  • PNLpanel

  • POSpositive

  • PPprepreg

  • PQFPplastic quad flat package

  • PROGprogram

  • PSFper square foot

  • PSIper square inch

  • PTperfect test / point

  • PTHplated-thru hole

  • PTSpoints

  • PWAprinted wiring assembly

  • PWBprinted wiring board

[ Go to TOP ]Alphabet Q

  • QAquality assurance

  • QCquality control

  • QEquality engineer

  • QFPquad flat pack

  • QPLquality product level

  • QTAquick-turn around

  • QUALqualification / qualify

[ Go to TOP ]Alphabet R

  • RADradius / radii

  • RCCresin coated copper foil

  • REFreference

  • REGregistration / register

  • REINreinforce

  • RELrelease

  • REMremove

  • REPrepresentative / represent

  • REPLreplace

  • REQrequest / require

  • RESresistor

  • RFQrequest for quotation

  • RMKremake

  • RProut program

  • RPRrepair

  • RPTreport

  • RTrout

  • RTFreverse-treat foil

  • RWKrework

[ Go to TOP ]Alphabet S

  • SBCsolder ball connect

  • SBUsequential built-up

  • SnTin

  • SNserial number

  • SCRNscreen

  • SPspace

  • SQsquare

  • SEPseparate

  • SECTsection

  • SHTsheet

  • SIASemiconductor Industry Association

  • SIGsignal

  • SIPsingle in-line package

  • SIRsur face insulation resistance (resistivity)

  • SLDsolder

  • SLTslot

  • SMCsurface-mount component

  • SMDsurface-mount device

  • SMPsurface-mount pad

  • SMTsurface-mount technology

  • SMOBCsolder mask over bare copper

  • SMOGBsolder mask over gold body

  • SPCstatistical process control

  • SPECspecification

  • STDstandard

  • SSsolder side

  • SSDSolid Solder Deposit

  • STKstock / stack

  • SYMsymbol

  • SRCSemiconductor Research Consor tium

  • S&Rscrap and rework

  • SLDsolder

  • SQFTsquare foot

  • SQINsquare inch

[ Go to TOP ]Alphabet T

  • TFtetra functional

  • Tgglass transition temperature

  • THtooling hole(s)

  • TPtrue position

  • TRtransfer

  • TABtape-automatic bonding

  • TDRtime domain reflectometer

  • TGPtrue grid position

  • TGTtarget

[ Go to TOP ]Alphabet U

  • ULUnderwriter┬┤s Laboratories Inc.

  • UAIuse as it

  • UOSunless otherwise specified

[ Go to TOP ]Alphabet V

  • Vvoltage = Volt

[ Go to TOP ]Alphabet W

  • Wwidth

  • W&Twarp and twist

  • WBwire bonding

  • WHTwhite

  • WEEEwaste electronic and electrical equipment

[ Go to TOP ]Alphabet X

  • XFPextra fine pitch

[ Go to TOP ]Alphabet Y

[ Go to TOP ]Alphabet Z

  • ZDSzero defect strategy

  • APRzero defect program

PCB Design Tips

PCB Design Tips

When designing a PCB, try to limit the amount of draws you use. Draws use a lot of memory and slow the programming time. Use a flash for pads instead.

More tips

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