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Capability

Electropolished laser cut framed stencil

Electropolished Laser Cut Framed Stencil

Technical Capability Statement
  • Stencil thickness 2.0, 3.8, 4.0, 5.0, 6.0, 7.0, 8.0 mils
  • Pitch limit 2mils
  • Min. aperture size 2mils (on 2mils sheet thickness)
  • Min. distance between apertures Same as stencil thickness
  • Min. distance between two adjacent Aperture’s wall gap Same as stencil thickness
  • Repeatability (Uniformity) +/- 0.1um
  • Aspect Ratio ≥ 0.66 ( material thickness )
  • Cutting accuracy +/- 5um (over entire print area )
  • Positioning Error +/- 4um
  • Axial precision +/-10 µm
  • Edge roughness < 3 µm
  • All opening walls are trapezoidal 0.8 mil Taper? Yes
  • 100% inspection, post-manufacture? Yes
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We have capability to manufacture Single Sided/Layer (SS), Double Sided/Layer (DS-NPTH & DS-PTH) and MultiLayer (up to 24 layers) PCBs with RoHS as an option.

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Our Capabilities

We have capability to manufacture Single Sided/Layer (SS), Double Sided/Layer (DS-NPTH & DS-PTH) and MultiLayer (up to 24 layers) PCBs with RoHS as an option.

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